Ric Lewis

Ric Lewis is Senior Vice President of Infrastructure for IBM and has global responsibility for the company’s servers, storage, associated software, and infrastructure support and services. He oversees IBM’s cloud business and also leads the IBM-wide mission for IBM Supply Chain.

Prior to joining IBM, Ric worked for 32 years at Hewlett Packard and Hewlett Packard Enterprise where he held numerous leadership roles focused on business and product innovation. Most recently, Ric was the Senior Vice President and General Manager of the Software Defined and Cloud Group, where his team incubated the software technology and strategy to enable as-a-service delivery of HPE’s entire portfolio. Ric’s groups created the industry-wide composable infrastructure product category and led it with an entirely new HW/SW design known as HPE Synergy that became the fastest new product/business in HP/HPE’s history to reach a billion dollars of revenue. 

Ric led businesses and R&D organizations delivering many innovative, successful products and upgrades for HP/HPE including HPE Simplivity hyperconverged systems, HP Converged Systems, HP Bladesystem, HP OneView, Superdome 2, Superdome X, NonStop systems, Integrity servers, and the HP-UX and OpenVMS operating environments. 

Fidelma Russo

Fidelma Russo is the Executive Vice President and General Manager of Hewlett Packard Enterprise's Hybrid Cloud business unit, and the company's Chief Technology Officer. Fidelma's Hybrid Cloud team is tasked with solving some of IT's biggest challenges, including transforming business through the power of data, modernizing IT infrastructure with a true cloud experience, and dramatically simplifying operations across hybrid cloud IT estates - all as they help customers accelerate their adoption of AI.

As the leader of this global organization of over 5,500 employees, Fidelma is responsible for driving the strategic direction, development, and execution of HPE's GreenLake platform, storage, private cloud, and SaaS solutions, along with creating an innovation pipeline through the capabilities and services of the Office of the CTO. 

Fidelma joined Hewlett Packard Enterprise in September 2021 as Chief Technology Officer, where she led the creation, development, and delivery of HPE's GreenLake platform, a central offering for all of HPE's edge-to-cloud solutions and cloud services.

Based in Houston, Texas, Fidelma has more than 30 years of technology leadership spanning machine learning and analytics, global IT business services, cloud services, servers, storage, networking, backup, and infrastructure.

Prior to joining Hewlett Packard Enterprise, Fidelma was Senior Vice President and General Manager of the Cloud Services business unit at VMware. She has held notable senior leadership positions including Chief Technology Officer and Executive Vice President at Iron Mountain, Senior Vice President and General Manager at EMC, Vice President of Adaptive Infrastructure at Hewlett-Packard, and Senior Vice President of Network, Storage, and Software at Sun Microsystems.

Fidelma was appointed to Equinix's Board of Directors and audit committee in June 2022, and she also sits on the HP International Bank's Board of Directors. In July 2023, Fidelma was recognized in CRN's Top 100 Executive awards and Top 25 IT Innovators of 2023.

Fidelma holds a Bachelor of Engineering degree in electrical engineering from University College Cork, a master's in computer science from Boston University, and completed the Internet of Things Executive Education program at MIT's Sloan School of Management.

Mark Papermaster

Mark Papermaster is Chief Technology Officer and Executive Vice President responsible for Advanced Micro Devices (AMD) technical direction and product development. He led the re-design of engineering processes at AMD and the development of the award-winning “Zen” high-performance x86 CPU family, high-performance GPUs and the company’s modular design approach, Infinity Architecture. He also oversees Information Technology (IT) that delivers AMD’s compute infrastructure and services.

His 40+ years of engineering experience includes significant leadership roles managing the development of a wide range of products, from microprocessors to mobile devices and high-performance servers. Before joining AMD in October 2011 as Chief Technology Officer and Senior Vice President, Papermaster was the leader of Cisco’s Silicon Engineering Group, Apple Senior Vice President of Devices Hardware Engineering for iPod and iPhone and held multiple IBM roles in technology development including blade server and the microprocessor technology in mainframe, server, and storage products.

In October 2024, he was appointed the Vice Chair of the US Department of Commerce Industrial Advisory Committee (IAC) for the CHIPS for America program. He is also an active member of several boards and committees, including the Global Semiconductor Alliance Board of Directors, IEEE Industry Advisory Board, The University of Texas at Austin Cockrell School of Engineering Advisory Board, The University of Texas President’s Austin Innovation Board, and Purdue University Semiconductor Degrees Leadership Board.

Papermaster received his bachelor’s degree from the University of Texas at Austin and master’s degree from the University of Vermont, both in Electrical Engineering.